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GOST 20485-75

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GOST 20485−75 Pike. The method for determining the wicking of solder into the gap (with Amendments No. 1, 2)


GOST 20485−75

Group B09


INTERSTATE STANDARD

SOLDERING

The method for determining the wicking of solder into the gap

Soldering and brazing. Method for determining the filling of the clearance by the solder


Date of introduction 1976−01−01


INFORMATION DATA

1. DESIGNED AND MADE with the USSR State Committee for standards

DEVELOPERS

I. G. Nahapetyan (supervisor), M. Kalinin

2. APPROVED AND put INTO EFFECT by Decision of the USSR State Committee on standards of February 7, 1975 N 350

3. The standard fully complies ST SEV 5686−86 and international standard ISO 5179−83

4. REFERENCE NORMATIVE AND TECHNICAL DOCUMENTS

   
The designation of the reference document referenced
Item number
GOST 7164−78
1.13; 2.8

5. The expiration time limit is removed by the Resolution of Gosstandart from 29.10.87 N 4092

6. EDITION (September 2000) with Amendments No. 1, 2 approved in February 1981, October 1987 (IUS 5−81, 1−88)


This standard specifies a method for determining wicking of solder into the horizontal gap by the ratio of wicking and porosity and the method for determining the wicking of solder in the vertical gap variable on the lift height.

(Changed edition, Rev. N 2).

1. THE METHOD FOR DETERMINING THE WICKING OF SOLDER IN THE HORIZONTAL GAP

1.1. For the test to be applied is made from soldered material two plates with dimensions of 40x40 mm and 20х15 mm.

1.2. The thickness of the plates should be from 1.0 to 2.0 mm. With thickness more than 2.0 mm, it is allowed machining of the side plates, not tested, to the desired thickness.

1.3. During the test shall be used solders, measured by volume, in the amount of 150% of the volume of the gap.

1.4. Surface preparation of the plates and solder to reflect the technological process of surface preparation prior to soldering.

1.5. Tests should be conducted with the flux or in the environment applicable in the relevant technological process of soldering.

1.6. Prepared plates should be assembled lap joint with a uniform gap of the desired size and arranged symmetrically. The size of the gap can be fixed by two spacers of the appropriate thickness located along the large sides of the plate size 20х15 mm.

1.7. The plates must be assembled so as to prevent their deformation throughout the test.

1.8. The gasket material should have a temperature of the melting point above the brazing temperature and do not interact with the brazed material and the solder.

1.9. The solder should be laid evenly close the gap along the lower side of the plate size 20х15 mm.

1.10. The sample in the testing process should be positioned horizontally.

1.11. The test installation should provide sample heating up to brazing temperature and maintaining it during the test.

1.12. Heating mode and cooling the specimen shall be set by the program test, the conditions of heating and cooling products.

1.13. Measurement and automatic recording of temperature should be conducted to the thermoelectric converters and automatic tracking devices trim GOST 7164 accuracy class not less than 0.5ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2).

1.14. Tests shall be not less than three samples.

1.13, 1.14. (Changed edition, Rev. N 2).

1.15. The fill factor ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2), %, is calculated by the formula

ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2),


where the ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2)square gap is filled with solder, mmГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2);

ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2) — the area of the top plate of the sample without the square strips, mmГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2).

1.16. Porosity ratio ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2), %, calculated by the formula

ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2),


where ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2)is the area of a pore, mmГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2)(the total area of the gas pores and non-wetting of the plots).

1.17. Value ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2)and ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2)should be measured by the devices providing the measurement error not more than 0.5 mmГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2), the image obtained after x-raying the samples, or directly on the sample after the removal of one of the plates by machining.

1.18. For the values ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2)and ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2)should be taken an arithmetical mean of the three obtained results.

(Changed edition, Rev. N 2).

2. THE METHOD FOR DETERMINING THE WICKING OF SOLDER IN THE VERTICAL GAP

2.1. For testing should be applied to a sample consisting of two tubes A and b of the brazed material in accordance with the devil.1.

2.2. The sample before testing should be collected in accordance with the devil.2. The material of the screws and baths should have a temperature of the melting point above the brazing temperature and do not interact with the brazed material and the solder.

2.3. Preparing the inner surface of the tube And the outer surface of the tube and solder to reflect the technological process of preparing a brazed surface of the product before soldering.

2.4. Solder pieces of size 15 to 20 mm should be inserted into the orifice of the inner tube is V.

The volume of the solder is not more than 1400 mmГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2).

2.5. Tests should be conducted with the flux or in the environment applicable in the relevant technological process of soldering.

2.6. Installation for testing must ensure the heating of the sample and solder to soldering temperature and maintaining it during the test.

2.7. Heating mode and cooling of the sample should be specified by the test programme, the conditions of heating and cooling products.

2.8. Measurement and automatic recording of temperature should be conducted to the thermoelectric converters and automatic tracking devices trim GOST 7164 accuracy class not less than 0.5.

2.9. Testing should be at least three samples.

2.10. Lifting height depending on the gap should be measured on the image obtained after x-raying the samples, or directly on the cut sample.

Translucence or cuts of the sample should be carried out in two axes in directions 1 and 2 in accordance with the devil.3.

2.11. The height shall measure instruments, provides measurement error not more than 0.5 mm.

2.12. The value of the height of the solder should take the arithmetic mean value of the three obtained results.

Sec. 2. (Changed edition, Rev. N 2).

ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2)

Damn.1

ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2)

Damn.2

ГОСТ 20485-75 Пайка. Метод определения затекания припоя в зазор (с Изменениями N 1, 2)

Damn.3

3. PROCESSING OF THE RESULTS


The test results shall be documented in the test report, which must include:

1) a brand or chemical composition of the brazed materials.

2) a brand or chemical composition of the solder;

3) the method of preparing the soldered material and solder;

4) environment testing, brand or chemical composition of flux or a gas environment;

5) the heat source;

6) test temperature, °C;

7) time of heating up to brazing temperature;

8) dwell time at the soldering temperature;

9) the cooling time to a temperature of 20 °C;

10) test results or a graph of the height by the clearance.

Sec. 3. (Added, Rev. N 2).